The Applications

1. High-Speed Robotic Pick-and-Place with Conveyor Tracking

In pick-and-place cells, the biggest accuracy killer is motion distortion when parts move under the camera. A global-shutter IMX267 sensor captures the entire frame at once, so edges, holes, and fiducials stay geometrically correct even at high belt speed. This improves coordinate stability for grasp planning and reduces “miss-picks” caused by skewed feature locations. The 9 MP class resolution helps distinguish similar parts and confirm orientation from small marks or corners. In practice, systems trigger captures from encoders and synchronize a strobe to use short exposure times, keeping images sharp while maintaining repeatable contrast.

2. Precision Dimensional Metrology for Machined Parts

Inline metrology needs repeatability, not just resolution. The IMX267 global shutter prevents subtle shape warping that can shift measured edges, especially when parts are indexed quickly or vibrate slightly. High pixel density supports sub-pixel edge fitting for bore diameters, slot widths, and chamfer verification, while the 1″ optical format allows a wider field of view without losing sampling detail. This can reduce camera count because one view covers more area at usable precision. With controlled illumination and timed acquisition, the sensor’s clean geometry helps algorithms reject spurious reflections on polished metal and maintain stable pass/fail thresholds.

3. Web Inspection for Coatings and Film Defects

Coating and film lines require consistent spatial mapping: defects must be located precisely along the moving web. The IMX267’s global shutter avoids smear that can hide thin streaks, pinholes, or edge cracks at high transport speeds. Its resolution enables detection of small defect signatures while still imaging enough width to monitor coating uniformity. Integrators typically use line-speed triggers to keep pixel-to-distance scaling constant, then tune exposure and gain to stabilize contrast across changing surface gloss. The 1″ format also supports optics that maintain corner-to-corner sharpness, which matters when defects can occur anywhere across the web.

4. PCB Assembly AOI for Fine-Pitch Solder Inspection

On PCB AOI stations, the challenge is capturing tiny, reflective solder joints without geometry errors during rapid indexing. With a global-shutter IMX267 sensor, pads and leads remain true-to-shape, which improves measurement of solder spread, bridging, and insufficient wetting. The high resolution allows smaller inspection windows around fine-pitch ICs and connectors while preserving context for fiducials and reference features. In real lines, strobed lighting is timed to minimize glare and suppress ambient flicker, then the camera is triggered at a repeatable mechanical settle point. This reduces false rejects and improves traceability when defects trend upward.

5. Structured-Light 3D Scanning and Laser Triangulation

3D reconstruction accuracy depends on undistorted patterns and crisp feature boundaries. The IMX267 global shutter keeps projected fringes or laser lines from “leaning” when either the part or scanning head is moving, improving depth computation stability. Its ~9 MP resolution increases point density, enabling better detection of small steps, embossed codes, warpage, and surface waviness. Many automation setups pulse the projector or laser and trigger the camera in tight timing windows, using short exposures to prevent blur while maintaining signal strength. The result is more reliable height maps for tolerance verification, robot guidance, and automated sorting at production throughput.

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